Semiconductor device with air gap on gate structure and method for forming the same

ABSTRACT

A semiconductor device structure is provided. The semiconductor device structure includes a source/drain contact structure formed over a semiconductor substrate, and a first gate stack formed over the semiconductor substrate and adjacent to the source/drain contact structure. The semiconductor device structure also includes an insulating cap structure formed over and separated from an upper surface of the first gate stack. In addition, the semiconductor device structure includes first gate spacers formed over opposing sidewalls of the first gate stack to separate the first gate stack from the source/drain contact structure. The first gate spacers extend over opposing sidewalls of the insulating cap structure, so as to form an air gap surrounded by the first gate spacers, the first gate stack, and the insulating cap structure.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. As the semiconductor industry hasprogressed into nanometer technology process nodes in pursuit of higherdevice density, higher performance, and lower costs, challenges fromboth fabrication and design issues have resulted in the development ofthree-dimensional designs, such as the fin field effect transistor(FinFET).

FinFETs are fabricated with a thin vertical “fin” (or fin structure)extending from a substrate. The advantages of a FinFET include areduction of the short channel effect and a higher current flow.

Although existing FinFET manufacturing processes have generally beenadequate for their intended purposes, they have not been entirelysatisfactory in all respects, especially as device scaling-downcontinues. For example, it is a challenge to a semiconductor devicestructure with reduced parasitic capacitance and reliable gatestructures at smaller and smaller sizes.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A to 1D illustrate perspective views of various stages ofmanufacturing a semiconductor device structure in accordance with someembodiments.

FIGS. 2A to 2R illustrate cross-sectional representations of variousstages of manufacturing a semiconductor device structure in accordancewith some embodiments.

FIGS. 3A to 3C illustrate cross-sectional representations of variousstages of manufacturing a semiconductor device structure in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Furthermore, spatially relative terms, such as “beneath,” “below,”“lower,” “above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. It should be understoodthat additional operations can be provided before, during, and after themethod, and some of the operations described can be replaced oreliminated for other embodiments of the method.

Embodiments for manufacturing semiconductor device structures areprovided. The semiconductor device structures may include a gate stackand a source/drain contact structure over a semiconductor substrate andadjacent to each other. An insulating cap structure is formed over thegate stack, and the insulating cap structure and the gate stack areseparated from each other by an air gap. Gate spacers extend over theopposing sidewalls of the gate stack and the opposing sidewalls of theinsulating cap, so that the air gap is surrounded by the gate spacers,the gate stack, and the insulating cap structure. The formation of theair gap includes forming a sacrificial layer over the gate stack.Afterwards, the sacrificial layer is covered with an insulating capstructure. The sacrificial layer is then removed, so as to form the airgap between the insulating cap structure and the gate stack. The air gaphas a lower the dielectric constant (k) than the other dielectricmaterials, so that the parasitic capacitance between the source/draincontact structure and the gate stack and between the interconnectstructure and the gate stack can be reduced. Moreover, the insulatingcap structure can be formed of a low-k material, so that the parasiticcapacitance can be lowered further. As a result, the device performancecan be effectively increased.

FIGS. 1A to 1D illustrate perspective views of various stages ofmanufacturing a semiconductor device structure and FIGS. 2A to 2Rillustrate cross-sectional representations of various stages ofmanufacturing a semiconductor device structure in accordance with someembodiments. In addition, FIGS. 2A to 2D illustrate the cross-sectionalrepresentations of the semiconductor device structure shown along line2-2′ in FIGS. 1A to 1D in accordance with some embodiments. In someembodiments, the semiconductor device structure is implemented as a finfield effect transistor (FinFET) structure.

A substrate 100 is provided, as shown in FIGS. 1A and 2A in accordancewith some embodiments. In some embodiments, the substrate 100 is asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g. with a P-type or an N-type dopant) or undoped. Generally, anSOI substrate includes a layer of a semiconductor material formed on aninsulator layer. The insulator layer may be, for example, a buried oxide(BOX) layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. In someembodiments, the substrate 100 is a wafer, such as a silicon wafer.

Other substrates, such as a multi-layered or gradient substrate may alsobe used. In some embodiments, the semiconductor material of thesubstrate 100 includes silicon; germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonide; an alloysemiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP; or a combination thereof. In some embodiments, thesubstrate 100 includes silicon. In some embodiments, the substrate 100includes an epitaxial layer. For example, the substrate 100 has anepitaxial layer overlying a bulk semiconductor.

In some embodiments, the substrate 100 has a PMOS region for P-typeFinFETs formed thereon and/or an NMOS region for N-type FinFETs formedthereon. In some embodiments, the PMOS region of the substrate 100includes Si, SiGe, SiGeB, or an III-V group semiconductor material (suchas InSb, GaSb, or InGaSb). The NMOS region of the substrate 100 includesSi, SiP, SiC, SiPC, or an III-V group semiconductor material (such asInP, GaAs, AlAs, InAs, InAlAs, or InGaAs).

Afterwards, a fin structure 101 and an isolation structure 103 formedover the substrate 100 is provided, as shown in FIG. 1A in accordancewith some embodiments. In some embodiments, the substrate 100 ispatterned to form at least one fin structure 101. The fin structure 101may have slope sidewalls and extend from the patterned substrate 100.

In some embodiments, the isolation structure 103 is a shallow trenchisolation (STI) structure, and the fin structure 101 is surrounded byand protrude above the isolation structure 103.

The isolation structure 103 may be formed by depositing an insulatinglayer (not shown) over the substrate 100 and recessing the insulatinglayer. The recessed insulating layer for the formation of the isolationstructure 103 may be made of silicon oxide, silicon nitride, siliconoxynitride, fluorosilicate glass (FSG), low-K dielectric materials,and/or another suitable dielectric material and may be deposited by aflowable CVD (FCVD) process, a chemical vapor deposition (CVD) process,an atomic layer deposition (ALD) process, or another applicable process.

Afterwards, dummy gate structures 111 a, 111 b, 111 c, and 111 d areformed across the fin structure 101 over the substrate 100 and cover theisolation structure 103, in accordance with some embodiments. Each ofthe dummy gate structures 111 a, 111 b, 111 c, and 111 d may include adummy gate dielectric layer 104 and a dummy gate electrode layer 106formed over the dummy gate dielectric layer 104. The dummy gatedielectric layer 104 may be made of silicon oxide and the dummy gateelectrode layer 106 may be made of polysilicon.

Gate spacers 108 are formed on the opposing sides (e.g., opposingsidewalls) of the dummy gate structures 111 a, 111 b, 111 c, and 111 dafter the formation of the dummy gate structures 111 a, 111 b, 111 c,and 111 d, in accordance with some embodiments. Each of the spacerlayers 108 adjacent to the corresponding dummy gate structure, as shownin FIGS. 1A and 2A in accordance with some embodiments.

The spacer layer 108 may be used for protecting dummy gate structures111 a, 111 b, 111 c, and 111 d from damage or loss during subsequentprocessing. The spacer layers 108 are made of silicon nitride, siliconoxide, silicon oxynitride, silicon carbide, or another applicabledielectric material.

After formation of the spacer layers 108, source/drain features 112 areformed in the fin structure 101 adjacent to and exposed from the dummygate structures 111 a, 111 b, 111 c, and 111 d, as shown in FIGS. 1A and2A in accordance with some embodiments. In some embodiments, thesource/drain features 112 is formed by recessing the fin structure 101exposed from the dummy gate structures 111 a, 111 b, 111 c, and 111 dand growing semiconductor materials in the formed recesses in the finstructure 101 by performing epitaxial (epi) growth processes.

In some embodiments, the semiconductor device structure is an NMOSdevice, and the source/drain features 112 include Si, SiP, SiC, SiPC, oran III-V group semiconductor material (such as InP, GaAs, AlAs, InAs,InAlAs, or InGaAs), or the like. In some embodiments, the semiconductordevice structure is a PMOS device, and the source/drain features 112include Si, SiGe, SiGeB, or an III-V group semiconductor material (suchas InSb, GaSb, or InGaSb), or the like. In some embodiments, thesource/drain features 112 protrude above the isolation structure 103.

A contact etch stop layer 110 and an insulating layer 120 aresuccessively formed over the isolation structure 103 after thesource/drain features 112 are formed, as shown in FIGS. 1B and 2B inaccordance with some embodiments. The contact stop layer 110 conformallycovers the gate spacers 108 over the opposing sidewalls of the dummygate structures 111 a, 111 b, 111 c, and 111 d, the source/drainfeatures 112, and the isolation structure 103. The contact etch stoplayer 110 may be used for forming contact holes (not shown) in thesource/drain features 112 and for protecting subsequent active gatestructures from damage or loss during subsequent processing. In someembodiments, the contact etch stop layer 110 is made of a material thatis different from that of the spacer layer 108, and includes siliconnitride, silicon oxide, silicon carbide, silicon oxynitride, or anotherapplicable material.

After the formation of the contact etch stop layer 110, the insulatinglayer 120 covers the contact etch stop layer 110 and the structure shownin FIGS. 1A and 2A. Afterwards, a polishing process is performed toremove the excess insulating layer 120 and the contact etch stop layer110 above the dummy gate structures 111 a, 111 b, 111 c, and 111 d, inaccordance with some embodiments. In some embodiments, such a polishingprocess is performed on the insulating layer 120 until the insulatinglayer 120 is planarized and the dummy gate structures 111 a, 111 b, 111c, and 111 d are exposed. In some embodiments, the polishing processincludes a chemical mechanical polishing (CMP) process.

The remaining insulating layer 120 (which serves as an interlayerdielectric (ILD) layer) may be made of silicon oxide, tetraethylorthosilicate (TEOS), phosphosilicate glass (PSG), borosilicate glass(BSG), boron-doped phosphosilicate Glass (BPSG), fluorosilicate glass(FSG), undoped silicate glass (USG), or the like. The insulating layer120 may be deposited by any suitable method, such as a chemical vapordeposition (CVD) process, a plasma enhanced CVD (PECVD) process,flowable CVD (FCVD) process, the like, or a combination thereof. Theinsulating layer 120 may be a single layer or include multipledielectric layers with the same or different dielectric materials.

Afterwards, the dummy gate structures 111 a, 111 b, 111 c, and 111 d areremoved and replaced by gate structures 118 a, 118 b, 118 c, and 118 d,as shown in FIGS. 1B and 2B in accordance with some embodiments. In someembodiments, each of the gate structures 118 a, 118 b, 118 c, and 118 dat least includes a gate dielectric layer 114, a gate electrode layer116, the spacer layers 108 and the portions of the contact etch stoplayer 110 adjacent to the spacer layers 108. The gate dielectric layer114 may be made of high-k materials, such as metal oxides, metalnitrides, or other applicable dielectric materials.

In some embodiments, the gate electrode layer 116 is made of aconductive material, such as aluminum, copper, tungsten, titanium,tantalum, or another applicable material. Each of the gate structures118 a, 118 b, 118 c, and 118 d may further include a work function metallayer (not shown) between the gate dielectric layer 114 and the gateelectrode layer 116, so that the gate structures 118 a, 118 b, 118 c,and 118 d have the proper work function values. An exemplary p-type workfunction metal layer may be made of TiN, TaN, Ru, Mo, Al, WN, or acombination thereof. An exemplary n-type work function metal layer maybe made of Ti, Ag, TaAl, TaAlC, TiAlN, TaC, TaCN, TaSiN, Mn, Zr, or acombination thereof.

Afterwards, the gate structures 118 a, 118 b, 118 c, and 118 d arerecessed by etching, so as to form recesses 123, as shown in FIGS. 1Cand 2C in accordance with some embodiments. During the etching, the topof the portions of the contact etch stop layer 110 adjacent to thespacer layers 108 are also recessed. In some embodiments, each of thegate electrode layers 138 is further recessed by etching after the uppersidewalls of the insulating layer 120 are exposed by the recesses 123,so that the recesses 123 are extended to form a T-shaped profile, asshown in FIG. 2C. Therefore, the upper surface of the gate spacers 108,the portions of the contact etch stop layer 110 adjacent to the gatespacers 108, and the upper surface of the gate dielectric layers 114 arehigher than the upper surface of the corresponding gate electrode layers116, in accordance with some embodiments.

Afterwards, a conductive capping layer 125 is formed to cover each ofthe recessed gate electrode layers 138, as shown in FIGS. 1C and 2C inaccordance with some embodiments. The conductive capping layers 125 andthe underlying gate electrode layer 116 form gate stacks of the gatestructures 118 a, 118 b, 118 c, and 118 d. In some embodiments, theupper surface of each gate spacer 120 is higher than the upper surfaceof each gate stack, as shown in FIGS. 1C and 2C. In some embodiments,the conductive capping layers 125 serve as etch stop layers orprotective layers for protecting the gate electrode layers 116 fromdamage or loss during subsequent processing, and are made of a metalmaterial, such as tungsten.

After the conductive capping layers 125 are formed, insulating caps 130a, 130 b, 130 c, and 130 d are respectively formed in the recesses 123(not shown and as indicated in FIGS. 1C and 2C) to cover thecorresponding conductive capping layer 125 and the corresponding gateelectrode layers 116, as shown in FIGS. 1D and 2D in accordance withsome embodiments. The insulating caps 130 a, 130 b, 130 c, and 130 d areformed to cover the upper surfaces of the gate structures 118 a, 118 b,118 c, and 140 d. In some embodiments, an insulating layer (not shown)used for formation of the insulating caps 130 a, 130 b, 130 c, and 130 dis formed over the structure shown in FIGS. 1C and 2C and fills therecesses 123.

For example, the insulating layer is made of a different material thanthe material of the insulating layer 120 and includes high-k materials,such as metal oxides including ZrO₂, HfO₂, or SiN. The insulating layermay be formed by performing a chemical vapor deposition (CVD) process, aplasma enhanced CVD (PECVD) process, low-pressure CVD (LPCVD) process,an atomic layer deposition (ALD) process, or another applicable process.

Afterwards, a polishing process, such as a chemical mechanical polishing(CMP) process, is performed to remove the excess insulating layer abovethe insulating layer 120 in accordance with some embodiments. After thepolishing process, the remaining insulating layer forms insulating caps130 a, 130 b, 130 c, and 130 d, as shown in FIGS. 1D and 2D.

In some embodiments, the upper surfaces of the insulating caps 130 a,130 b, 130 c, and 130 d are substantially level with the upper surfaceof the insulating layer 120. The insulating caps 130 a, 130 b, 130 c,and 130 d serve as etch stop layers and protect the gate structures 118a, 118 b, 118 c, and 118 d in the subsequent manufacturing processes(e.g., etching processes).

After the insulating caps 130 a, 130 b, 130 c, and 130 d are formed, apatterned insulating layer 136 and a patterned masking layer 138 aresuccessively formed over the structure shown in FIGS. 1D and 2D, inaccordance with some embodiments. In some embodiments, the insulatinglayer 136 is patterned using the patterned masking layer 138 as an etchmask. In some embodiments, the method and the material used for formingthe insulating layer 120 are used for forming the insulating layer 136.

Afterwards, the masking layer 138 is formed over the insulating layer136. In some embodiments, the masking layer 138 includes a tri-layerresist structure including a bottom layer, a middle layer, and a toplayer. In order to simplify the diagram, only a flat layer (i.e., themasking layer 138) is depicted.

For example, the bottom layer is a first layer of the tri-layer resiststructure. The bottom layer may contain a material that is patternableand/or have an anti-reflection property, such as a bottomanti-reflective coating (BARC) layer or a nitrogen-free anti-reflectivecoating (NFARC) layer. In some embodiments, the bottom layer is formedby a spin-on coating process, a chemical vapor deposition (CVD) process,a physical vapor deposition (PVD) process, or another suitabledeposition process. The middle layer is formed over the bottom layer andis a second layer of the tri-layer resist structure. The middle layer(which is also referred to as a hard mask layer) provides hard maskproperties for the photolithography process. In addition, the middlelayer is designed to provide etching selectivity from the bottom layerand the top layer. In some embodiments, the middle layer is made ofsilicon nitride, silicon oxynitride or silicon oxide and is formed by aspin-on coating process, a chemical vapor deposition (CVD) process, aphysical vapor deposition (PVD) process, or another suitable depositionprocess.

The top layer is formed over the middle layer and is a third layer ofthe tri-layer resist structure. The top layer may be positivephotoresist or negative photoresist. In some other embodiments, thetri-layer resist structure includes oxide-nitride-oxide (ONO) layers.

Afterwards, the masking layer 138 is patterned to form an opening toexpose a source/drain contact region (not shown) of the underlyinginsulating layer 136, in accordance with some embodiments.

An etching process is performed on the exposed insulating layer 136, theunderlying insulating layer 120, and the portions of the contact etchstop layer 110 covering the source/drain features 112, so as to form aself-aligned opening 140, as shown in FIG. 2E in accordance with someembodiments. During the self-aligned opening 140 is formed, theinsulating caps 130 b, 130 c, and 130 d are used as etch masks forprotecting the gate structures 118 b, 118 c, and 118 d. As a result, theself-aligned opening 140 is formed through the insulating layers 136 and120 to expose the upper surfaces of some source/drain features 112, asshown in FIG. 2E.

In some embodiments, the self-aligned opening 140 is formed by etchingthe insulating layers 136 and 120 between the insulating caps 130 b, 130c, and 130 d. During the etching of the insulating layers 136 and 120,and the contact etch stop layer 110, the etch masks (i.e., insulatingcaps 130 b, 130 c, and 130 d) define some source/drain contact regionsbetween the gate structures. For example, the source/drain contactregions are between gate structures 118 b, 118 c, and 118 d. Althoughsome portions of the insulating caps 130 a, 130 b, 130 c, and 130 d mayalso be removed during the etching for formation of the self-alignedopening 140, the gate structures 118 b, 118 c, and 118 d are stillprotected by the insulating caps 130 b, 130 c, and 130 d.

After the self-aligned opening 140 is formed, an ion implantationprocess may be performed to dope impurity (e.g., p-type impurities) intothe exposed source/drain features 112. Afterwards, a salicide processmay be performed to form salicide layers (not shown) over the exposedthe upper surfaces of the source/drain features 112. The salicide layersmay be formed by forming a metal layer over the upper surfaces of thesource/drain features 112. Afterwards, an annealing process is performedon the metal layer so the metal layer reacts with the source/drainfeatures 112. Afterwards, the unreacted metal layer is removed to formthe salicide layers. Examples for forming the metal layer may includeTi, Co, Ni, NiCo, Pt, Ni(Pt), Ir, Pt(Ir), Er, Yb, Pd, Rh, Nb, TiSiN, andthe like.

Afterwards, the masking layer 138 is removed and gate spacers 141 areformed in the lower portion of the self-aligned opening 140, as shown inFIG. 2F in accordance with some embodiments. In some embodiments, aninsulating layer (not shown), such as silicon nitride is conformallyformed over the structure shown in FIG. 2W without the masking layer138. Afterwards, an etching process is performed on the insulatinglayer. The remaining insulating layers form gate spacers 141 adjacent tothe portions of the contact etch stop layer 110 exposed from the lowerportion of the self-aligned opening 140.

Source/drain contact structures 142 fill the self-aligned opening 140between the gate structures 118 b, 118 c, and 118 d and between theinsulating caps 130 b, 130 c, and 130 d, as shown in FIG. 2G inaccordance with some embodiments. In some embodiments, the source/drainconductive structure 142 is made of Co, Ru, W, Cu, or the like. Aconductive material (not shown) may be formed over the insulating layer136 and fill the self-aligned opening 140 by a chemical vapor deposition(CVD) process, a physical vapor deposition, (PVD) process, an atomiclayer deposition (ALD) process, an electroless deposition (ELD) process,an electrochemical plating (ECP) process, or another applicable process.

Afterwards, a polishing process is performed to remove the excessconductive material and the insulating layer 136 above the insulatingcaps 130 a, 130 b, 130 c, and 130 d, in accordance with someembodiments. In some embodiments, such a polishing process is performedon the conductive material, the insulating layer 136 and portions of theinsulating caps 130 a, 130 b, 130 c, and 130 d until the insulating caps130 a, 130 b, 130 c, and 130 d are exposed and planarized. In someembodiments, the polishing process includes a chemical mechanicalpolishing (CMP) process.

After the polishing process, the remaining conductive material forms thesource/drain contact structures 142 between and adjacent to the gatestructures 118 b and 118 c, and between and adjacent to the gatestructures 118 d and 118 c, as shown in FIG. 2G. Those source/draincontact structures 142 are electrically connected to the correspondingsource/drain features 112, and separated from the gate stacks by thegate spacers 108 that are formed over opposing sidewalls of the gatestacks. Moreover, the upper surface of the source/drain contactstructures 142 is substantially level with the upper surface of theplanarized insulating caps 130 a, 130 b, 130 c, and 130 d.

Afterwards, each of the source/drain contact structures 142 is recessed,so that each of the source/drain contact structures 142 has an uppersurface that is lower than the bottom surface of the planarizedinsulating caps 130 a, 130 b, 130 c, and 130 d, as shown in FIG. 2H inaccordance with some embodiments. After the source/drain contactstructures 142 are recessed, the conductive capping layers 125 have anupper surface that is higher than the upper surface of the source/draincontact structures 142. Moreover, each of the source/drain contactstructures 142 successively covered by an optional conductive cappinglayer 146 and a masking layer 148, as shown in FIG. 2H in accordancewith some embodiments.

In some embodiments, the conductive capping layer 146 is in contact withthe corresponding source/drain contact structure 142, and includes amaterial that is the same or similar to that of the conductive cappinglayer 125. For example, the conductive capping layer 146 may be made ofmetal, such as tungsten, and formed by a selective deposition process.In some embodiments, the conductive capping layers 125 have an uppersurface that is higher than the upper surface of the conductive cappinglayer 146.

In some embodiments, the masking layer 148 is made of an insulatingmaterial that is the same as or different from the insulating layer 120.For example, the masking layer 148 may be made of silicon oxide orsilicon nitride and formed by a method that is the same as or similar tothe insulating layer 120. After the masking layer 148 is formed, theupper surface of the masking layer 148 is substantially level with theupper surface of the planarized insulating caps 130 a, 130 b, 130 c, and130 d, as shown in FIG. 2H in accordance with some embodiments.

After the masking layers 148 are formed, patterned insulating layers 150and 152 are successively formed over the structure shown in FIG. 2H, asshown in FIG. 2I in accordance with some embodiments. More specifically,insulating layers 150 and 152 are successively formed over theinsulating layer 120 and the planarized insulating caps 130 a, 130 b,130 c, and 130 d. In some embodiments, the method and the material usedfor forming the masking layer 148 are used for forming the insulatinglayer 150. Moreover, the method and the material used for forming theinsulating layer 120 or 136 are used for forming the insulating layer152.

Afterwards, the insulating layer 152 is patterned to form openings 156and 158 to expose the insulating layer 150, in accordance with someembodiments. Such a patterning process is a dry etching process usingthe insulating layer 150 as an etch stop layer, in accordance with someembodiments. Afterwards, in some embodiments, the exposed insulatinglayer 150 is removed by an etching process, such as a dry etchingprocess, to expose the insulating cap 130 a, the masking layers 148, andtop corners of the insulating caps 130 b, 130 c, and 130 d.

Afterwards, in some embodiments, the exposed insulating cap 130 a andthe exposed masking layers 148 are successively removed using theconductive capping layers 125 and 146 as an etch stop layer, so as toextend the openings 156 and 158 to the conductive capping layers 125 and146, respectively. The opening 156 may be referred to as a self-alignedgate via opening, and the opening 158 may be referred to as aself-aligned source/drain via opening. During the removal of the maskinglayers 148, the exposed top corners of the insulating caps 130 b, 130 c,and 130 d may also be etched, so that those top corners are rounded.

After the openings 156 and 158 are formed, a conductive material 160 isformed over the insulating layer 152 and fills the openings 156 and 158,as shown in FIG. 2J in accordance with some embodiments. The conductivematerial 160 may be made of metal, such as W or Ru and formed by achemical vapor deposition (CVD) process, a physical vapor deposition,(PVD) process, an atomic layer deposition (ALD) process, an electrolessdeposition (ELD) process, an electrochemical plating (ECP) process, oranother applicable process.

Afterwards, a polishing process is performed to remove the excessconductive material 160 and the underlying layers until the insulatingcaps 130 b, 130 c, and 130 d, the gate spacers 108, the portions of thecontact etch stop layer 110 adjacent to the gate spacers 108, and theinsulating layer 120 are exposed and planarized, as shown in FIG. 2K inaccordance with some embodiments. In some embodiments, the polishingprocess includes a chemical mechanical polishing (CMP) process.

Moreover, the insulating caps 130 b, 130 c, and 130 d, the gate spacers108, the portions of the contact etch stop layer 110 adjacent to thegate spacers 108, and the insulating layer 120 have upper surfaces thatare substantially level with the upper surface of the remainingconductive material 160.

After the polishing process, the remaining conductive material 160 formsa conductive via structures 162 and 164, as shown in FIG. 2K inaccordance with some embodiments. In some embodiments, the via structure162 in direct contact to the conductive capping layer 125 toelectrically connect the gate electrode layer 116 of the gate structure118 a. Therefore, the via structure 162 is referred to as a gate viastructure. Each of the via conductive via structures 164 is in directcontact to the corresponding conductive capping layer 146 toelectrically connect the corresponding source/drain contact structure142. Therefore, the via structure 164 is referred to as a source/drainvia structure.

After the polishing process, the remaining conductive material 160 formsthe gate via structure 162 and source/drain via structures 164 betweenand adjacent to the gate structures 118 b, 118 c, and 118 d, as shown inFIG. 2K in accordance with some embodiments. The gate via structure 162is in direct contact with and electrically connected to the gate stackof the gate structure 118 a. Those source/drain via structures 164 arein direct contact with electrically connected to the correspondingconductive capping layer 146 on the corresponding source/drain features112.

Afterwards, the insulating capping layers 130 b, 130 c, and 130 d areremoved from the gate structures 118 b, 118 c, and 118 d to formrecesses 167 with a depth D above the gate structures 118 b, 118 c, and118 d, as shown in FIG. 2L in accordance with some embodiments. In someembodiments, those recesses 167 are formed by an etching process, suchas a dry or wet etching process.

After those recesses 167 are formed, a sacrificial layer 172 is formedin each of the recesses 167, as shown in FIGS. 2M to 2N in accordancewith some embodiments. As shown in FIG. 2M, a heat depolymerizedmaterial layer 170 is formed over the structure shown in FIG. 2L andfills in the recesses 167. The heat depolymerized material layer 170includes a polymer which is formed by polymerizing at least twodifferent reactants (e.g., monomers). Such a polymer can bedepolymerized by heat. Sometimes such a heat depolymerized materiallayer 170 is also referred to as an ashless carbon (ALC) layer. The heatdepolymerized material layer 170 may be formed by a plasma depositionprocess, such as a chemical vapor deposition (CVD) process, a physicalvapor deposition, (PVD) process, an atomic layer deposition (ALD)process, or another applicable process.

Afterwards, the heat depolymerized material layer 170 is etched back toexpose a portion of each recess 167, as shown in FIG. 2N in accordancewith some embodiments. In some embodiments, the remaining heatdepolymerized material layer 170 forms the sacrificial layers 172 in therecesses 167, respectively. Each of the sacrificial layers 172 has anupper surface that is lower than the top of the corresponding recess167. Each of the sacrificial layers 172 has a thickness that is in arange from about 1 nm to about D−1 nm (where “D” is the depth of therecess 167, as shown in FIG. 2L). In some embodiments, the heatdepolymerized material layer 170 is etched back by an annealing processusing O₂, N₂, NH, HF, F₂, or a combination thereof as a process gas. Theannealing process may be performed at a temperature in a range fromabout 200° C. to about 500° C. for a period in a range from about 30seconds to 5 minutes.

In some other embodiments, the heat depolymerized material layer 170 isetched back by a dry etching process using CF₄, CHF₃, O₂, O₃, or acombination thereof as a process gas. Alternatively, the heatdepolymerized material layer 170 is etched back by an ashing processusing O₂, O₃, or a combination thereof as a process gas.

After the recesses 167 and the sacrificial layers 172 are formed, airgaps 178 and insulating cap structures 184 respectively covering the airgaps 178 are formed, as shown in FIGS. 2O to 2R in accordance with someembodiments. More specifically, a capping layer 176 is conformallyformed to cover the structure shown in FIG. 2N to cover the insulatinglayer 120, the via structures 162 and 164, and the sacrificial layers172 in the recesses 167, as shown in FIG. 2O in accordance with someembodiments. The capping layer 176 extends on and makes direct contactwith the sidewalls and the bottom of the recesses 167. In someembodiments, the capping layer 176 is used for formation of theinsulating cap structures 184 (as indicated in FIG. 2R) in the recesses167. In some embodiments, the capping layer 176 has a thickness that isin a range from about 0.5 nm to about 5 nm. Moreover, the capping layer176 is made of a low-k material, such as SiO₂, SiOC, SiN, or SiCN.Therefore, the subsequently formed insulating cap structures (whichinclude the capping layer 176) in the recesses 167. The capping layer176 may be formed by performing a low temperature deposition process,such as a chemical vapor deposition (CVD) process, or another applicableprocess. For example, the low temperature deposition process isperformed at a temperature that is in a range from about 200° C. toabout 400° C.

After the formation of the capping layer 176, the sacrificial layers 172in the recesses 167 are removed to form air gaps 178, so that theconductive capping layer 125 is between the corresponding air gap 178and the corresponding electrode layer 116, as shown in FIG. 2P inaccordance with some embodiments. Each of the air gaps 178 separates thecorresponding gate stack from the insulating capping layer 176. In someembodiments, the sacrificial layers 172 in the recesses 167 are removedby an annealing process. For example, the annealing process may beperformed using O₂, N₂, NH, HF, F₂, or a combination thereof as aprocess gas. The annealing process may be performed at a temperature ina range from about 250° C. to about 500° C. for a period in a range fromabout 20 seconds to 5 minutes.

Afterwards, a capping layer 180 is formed to cover the capping layer 176and fills the remaining recesses 167, as shown in FIG. 2Q in accordancewith some embodiments. In some embodiments, the capping layer 180 isalso used for formation of the insulating cap structures in the recesses167. The capping layer 180 is made of a low-k material, such as SiO₂,SiOC, SiN, or SiCN. Therefore, the subsequently formed insulating capstructures (which include the capping layer 180) in the recesses 167.The capping layer 180 may be formed by performing a high temperaturedeposition process, such as a chemical vapor deposition (CVD) process,or another applicable process. For example, the high temperaturedeposition process is performed at a temperature that is in a range fromabout 250° C. to about 400° C.

Afterwards, a polishing process is performed to remove the excesscapping layers 180 and 176 above the insulating layer 120, as shown inFIG. 2R in accordance with some embodiments. In some embodiments, such apolishing process is successively performed on the capping layers 180and 176 until the upper surface of the insulating layer 120 is exposed.In some embodiments, the polishing process includes a chemicalmechanical polishing (CMP) process.

After the polishing process, the remaining capping layers 180 and 176form insulating cap structures 184, as shown in FIG. 2R. In someembodiments, the upper surfaces of the insulating cap structures 184 aresubstantially level with the upper surfaces of the insulating layer 120,the via structures 162 and 164. In some embodiments, in the insulatingcap structure 184, the remaining capping layer 176 covers the bottom andopposite sidewalls of the remaining capping layer 180. In other words,in each of the insulating cap structures 184, the remaining cappinglayer 176 has a U-shaped profile, so that the opposite sidewalls and thebottom of the remaining capping layer 180 is covered by the cappinglayers 170. Moreover, each of the formed air gaps 178 is surrounded bythe corresponding gate spacers 108, the corresponding gate stack of thegate structure 118 b, 118 c, or 118 d, and the corresponding insulatingcap structure 184.

Although the semiconductor device structure formed by the methods shownin FIGS. 2A to 2R includes air gaps 178 that are formed by removing thesacrificial layers 172 before the insulating capping layer 180 isformed, embodiments of the disclosure are not limited thereto. Manyvariations and/or modifications can be made to embodiments of thedisclosure. For example, the air gaps 178 may be formed by removing thesacrificial layers 172 after the insulating capping layer 180 is formed.

FIGS. 3A to 3C illustrate cross-sectional representations of variousstages of manufacturing a semiconductor device structure in accordancewith some embodiments. A structure shown in FIG. 2O is provided, and acapping layer 180 is formed to cover the capping layer 176 and fills theremaining recesses 167, as shown in FIG. 2A in accordance with someembodiments.

Afterwards, a polishing process, such as a chemical mechanical polishing(CMP) process, is performed to remove the excess capping layers 180 and176 above the insulating layer 120, as shown in FIG. 3B in accordancewith some embodiments. In some embodiments, such a polishing process issuccessively performed on the capping layers 180 and 176 until the uppersurface of the insulating layer 120 is exposed. After the polishingprocess, the remaining capping layers 180 and 176 form insulating capstructures 184 (not shown and indicated in FIG. 3C).

After the formation of the capping layer 180, the sacrificial layers 172in the recesses 167 are removed to form air gaps 178, so that theconductive capping layer 125 is between the corresponding air gap 178and the corresponding electrode layer 116, as shown in FIG. 3C inaccordance with some embodiments. Each of the air gaps 178 separates thecorresponding gate stack from the insulating capping layer 176.

Embodiments of semiconductor device structures and methods for formingthe same are provided. The formation of the semiconductor devicestructure includes forming a gate stack and a source/drain contactstructure over a semiconductor substrate and adjacent to each other.Afterwards, an insulating cap structure is formed over the gate stackand separated from the upper surface of the gate stack by an air gap.The air gap has a lower dielectric constant (k) than that of the otherdielectric materials, so that the parasitic capacitance between thesource/drain contact structure and the gate stack and between theinterconnect structure and the gate stack can be reduced. As a result,the device performance can be effectively increased.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a source/drain contact structureformed over a semiconductor substrate, and a first gate stack formedover the semiconductor substrate and adjacent to the source/draincontact structure. The semiconductor device structure also includes aninsulating cap structure formed over and separated from an upper surfaceof the first gate stack. In addition, the semiconductor device structureincludes first gate spacers formed over opposing sidewalls of the firstgate stack to separate the first gate stack from the source/draincontact structure. The first gate spacers extend over opposing sidewallsof the insulating cap structure, so as to form an air gap surrounded bythe first gate spacer, the first gate stack, and the insulating capstructure.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a fin structure over asemiconductor substrate. The semiconductor device structure alsoincludes a first gate structure and a second gate structure adjacent toeach other and across the fin structure. Each of the first gatestructure and the second gate structure includes a gate electrode layer,gate spacers formed over opposing sidewalls of the gate electrode layer,and a gate dielectric layer between the gate electrode layer and thesemiconductor substrate and between the gate electrode layer and thegate spacers. In addition, the semiconductor device structure includesan insulating cap structure formed over and separated from the uppersurface of the electrode layer of the first gate structure. The gatespacers of the first gate structure extend over opposing sidewalls ofthe insulating cap structure, so as to form an air gap between theelectrode layer of the first gate structure and the insulating capstructure.

In some embodiments, a method for forming a semiconductor devicestructure is provided. The method includes forming a gate structure overa semiconductor substrate and across a fin structure of thesemiconductor substrate. The gate structure includes a gate electrodelayer and gate spacers formed over opposing sidewalls of the gateelectrode layer. The method also includes covering the gate electrodelayer with an insulating cap and forming a source/drain contactstructure over the semiconductor substrate and adjacent to the gatestructure. The source/drain contact structure has an upper surface thatis lower than a bottom surface of the insulating cap. The method furtherincludes forming a source/drain via structure over and electricallyconnected to the source/drain contact structure. In addition, the methodincludes removing the insulating cap to form a recess and forming asacrificial layer in the recess. The method also includes forming afirst insulating capping layer in the recess to cover the sacrificiallayer and forming a second insulating capping layer in the second recessto cover the first insulating capping layer. The method further includesremoving the sacrificial layer in the recess to form an air gapseparating the gate electrode layer from the first insulating cappinglayer.

The fins described above may be patterned by any suitable method. Forexample, the fins may be patterned using one or more photolithographyprocesses, including double-patterning or multi-patterning processes.Generally, double-patterning or multi-patterning processes combinephotolithography and self-aligned processes, allowing patterns to becreated that have, for example, pitches smaller than what is otherwiseobtainable using a single, direct photolithography process. For example,in one embodiment, a sacrificial layer is formed over a substrate andpatterned using a photolithography process. Spacers are formed alongsidethe patterned sacrificial layer using a self-aligned process. Thesacrificial layer is then removed, and the remaining spacers may then beused to pattern the fins.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor device structure, comprising: asource/drain contact structure formed over a semiconductor substrate; afirst gate stack formed over the semiconductor substrate and adjacent tothe source/drain contact structure; an insulating cap structure formedover and separated from an upper surface of the first gate stack; andfirst gate spacers formed over opposing sidewalls of the first gatestack to separate the first gate stack from the source/drain contactstructure, wherein the first gate spacers extend over opposing sidewallsof the insulating cap structure, so as to form an air gap surrounded bythe first gate spacers, the first gate stack, and the insulating capstructure.
 2. The semiconductor device structure as claimed in claim 1,wherein the insulating cap structure comprises: a first capping layer;and a second capping layer having a bottom and opposite sidewallscovered by the first capping layer, wherein the first capping layer andthe second capping layer comprise a low-k material.
 3. The semiconductordevice structure as claimed in claim 1, further comprising a viastructure formed over and electrically connected to the source/draincontact structure.
 4. The semiconductor device structure as claimed inclaim 3, further comprising a conductive capping layer in contact withthe source/drain contact structure and the via structure.
 5. Thesemiconductor device structure as claimed in claim 3, further comprisingsecond gate spacers extending over opposing sidewalls of thesource/drain contact structure and opposing sidewalls of the viastructure.
 6. The semiconductor device structure as claimed in claim 1,wherein the first gate stack comprises: a gate electrode layer; and aconductive capping layer between the gate electrode layer and the airgap, wherein the conductive capping layer has an upper surface that ishigher than an upper surface of the source/drain contact structure. 7.The semiconductor device structure as claimed in claim 1, furthercomprising: a second gate stack formed over the semiconductor substrate;a via structure formed over and electrically connected to the secondgate stack; and second gate spacers formed over opposing sidewalls ofthe second gate stack, wherein an insulating layer is formed between oneof the first gate spacers and one of the second gate spacers.
 8. Thesemiconductor device structure as claimed in claim 7, wherein the secondgate stack comprises: a gate electrode layer; and a conductive cappinglayer in contact with the gate electrode layer and the via structure. 9.A semiconductor device structure, comprising: a fin structure over asemiconductor substrate; a first gate structure and a second gatestructure adjacent to each other and across the fin structure, whereineach of the first gate structure and the second gate structurecomprises: a gate electrode layer; gate spacers formed over opposingsidewalls of the gate electrode layer; and a gate dielectric layerbetween the gate electrode layer and the semiconductor substrate andbetween the gate electrode layer and the gate spacers; and an insulatingcap structure formed over and separated from an upper surface of theelectrode layer of the first gate structure, wherein the gate spacers ofthe first gate structure extend over opposing sidewalls of theinsulating cap structure, so as to form an air gap between the electrodelayer of the first gate structure and the insulating cap structure. 10.The semiconductor device structure as claimed in claim 9, furthercomprising: a source/drain feature formed in the fin structure andadjacent to the first gate structure; and a source/drain contactstructure formed over and electrically connected to the source/drainfeature.
 11. The semiconductor device structure as claimed in claim 10,further comprising: a first via structure formed over and electricallyconnected to the source/drain contact structure; and a second viastructure formed over and electrically connected to the electrode layerof the second gate structure.
 12. The semiconductor device structure asclaimed in claim 11, further comprising: a first conductive cappinglayer formed between the first via structure and the source/draincontact structure; a second conductive capping layer formed between thesecond via structure and the electrode layer of the second gatestructure; and a third conductive capping layer formed between the airgap and the electrode layer of the first gate structure.
 13. Thesemiconductor device structure as claimed in claim 12, wherein thesecond conductive capping layer and the third capping layer have anupper surface that is higher than an upper surface of the firstconductive capping layer.
 14. The semiconductor device structure asclaimed in claim 9, wherein the insulating cap structure comprises: afirst capping layer; and a second capping layer covering a bottom andopposite sidewalls of the first capping layer.
 15. The semiconductordevice structure as claimed in claim 14, wherein the first capping layerand the second capping layer comprise a low-k material.
 16. A method forforming a semiconductor device structure, comprising: forming a gatestructure over a semiconductor substrate and across a fin structure ofthe semiconductor substrate, wherein the gate structure comprises: agate electrode layer; and gate spacers formed over opposing sidewalls ofthe gate electrode layer; covering the gate electrode layer with aninsulating cap; forming a source/drain contact structure over thesemiconductor substrate and adjacent to the gate structure, wherein thesource/drain contact structure has an upper surface that is lower than abottom surface of the insulating cap; forming a source/drain viastructure over and electrically connected to the source/drain contactstructure; removing the insulating cap to form a recess; forming asacrificial layer in the recess; forming a first insulating cappinglayer in the recess to cover the sacrificial layer; forming a secondinsulating capping layer in the second recess to cover the firstinsulating capping layer; and removing the sacrificial layer in therecess to form an air gap separating the gate electrode layer from thefirst insulating capping layer.
 17. The method as claimed in claim 16,wherein the formation of the sacrificial layer comprises: depositing aheat depolymerized material layer over the source/drain via structureand in the recess; and etching back the heat depolymerized materiallayer by an annealing, dry etching, or ashing process, so as to use theremaining heat depolymerized material layer as the sacrificial layer,wherein the sacrificial layer has an upper surface that is lower than atop of the recess.
 18. The method as claimed in claim 17, wherein thesacrificial layer is removed by an annealing process before the secondinsulating capping layer is formed.
 19. The method as claimed in claim17, wherein the sacrificial layer is removed by an annealing processafter the second insulating capping layer is formed.
 20. The method asclaimed in claim 16, wherein the insulating cap comprises a high-kmaterial and the first insulating capping layer and the secondinsulating capping layer comprise a low-k material.